Datasheet

A1
B1
C1
A2
B2
D
E
C2
A3
B3
C3
YMS
CC
LLLL
A1
TPS61253, TPS61254, TPS61256
TPS61258, TPS61259
SLVSAG8C –SEPTEMBER 2011–REVISED AUGUST 2012 www.ti.com
PACKAGE SUMMARY
CHIP SCALE PACKAGE
CHIP SCALE PACKAGE
(BOTTOM VIEW)
(TOP VIEW)
Code:
• YM - 2 digit date code
• S - assembly site code
• CC - chip code (see ordering
table)
• LLLL - lot trace code
PACKAGE DIMENSIONS
The dimensions for the YFF-9 package are shown in Table 5. See the package drawing at the end of this data
sheet.
Table 5. YFF-9 Package Dimensions
Packaged Devices D E
TPS6125xYFF 1.206 ±0.03 mm 1.306 ±0.03 mm
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Product Folder Links: TPS61253 TPS61254 TPS61256 TPS61258 TPS61259