Datasheet

TPS61253, TPS61254, TPS61256
TPS61258, TPS61259
www.ti.com SLVSAG8C –SEPTEMBER 2011–REVISED AUGUST 2012
THERMAL INFORMATION
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-
dissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below:
• Improving the power dissipation capability of the PCB design
• Improving the thermal coupling of the component to the PCB
• Introducing airflow in the system
As power demand in portable designs is more and more important, designers must figure the best trade-off
between efficiency, power dissipation and solution size. Due to integration and miniaturization, junction
temperature can increase significantly which could lead to bad application behaviors (i.e. premature thermal
shutdown or worst case reduce device reliability).
Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where
high maximum power dissipation exists (e.g. TPS61253 or TPS61259 based solutions), special care must be
paid to thermal dissipation issues in board design. The device operating junction temperature (T
J
) should be kept
below 125°C.
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Product Folder Links: TPS61253 TPS61254 TPS61256 TPS61258 TPS61259