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TPS6125xEVM-766 Assembly Drawing and Layout www.ti.com
5 TPS6125xEVM-766 Assembly Drawing and Layout
Figure 6 through Figure 10 show the design of the TPS6125xEVM-766 PCBs. The EVM has been
designed using a four-layer, 1-ounce copper-clad PCB with all components in an active area on the top
side of the board. Moving components to both sides of the PCB can offer additional size reduction for
space-constrained systems.
Figure 6. TPS6125xEVM-766 Component Placement (Viewed TOP)
8
TPS6125xEVM-766, 3.5-MHz High Efficiency Step-Up Converter In Chip SLVU744–August 2012
Scale Packaging EVM
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