Datasheet

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Bill of Materials

6 Bill of Materials

Table 2 lists the EVM components as configured according to the schematic shown in Figure 1.

Table 2. TPS6125xEVM-766 Bill of Materials

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-001 -002 -003 RefDes VALUE Description Size Part Number MFR

1 1 1 C1** 4.7 µF Capacitor, Ceramic, 6.3V, X5R, 0402 GRM155R60J475U muRata

20%

2 2 2 C2, C3** 10 µF Capacitor, Ceramic, 6.3V, X5R, 0603 GRM188R60J106ME84D muRata

20%

1 1 1 C4 150 µF Capacitor, 6.3V, Temp 15%, ±20%, 3528(B) T520B157M006ATE070 Kemet

70mOhm

6 6 6 J1, J2, J3, J4, PEC02SAAN Header, Male 2-pin, 100mil spacing, 0.100 inch x 2 PEC02SAAN Sullins

J5, J6

0 0 0 J7, J8 Open Connector, SMA , Straight, PC 0.210 sq inch 901-144-8RFX AMP

mount

0 0 0 J9, J10 Open Header, Male 2-pin, 200mil spacing, 0.100 inch x 2 PEC03SAAN Sullins

2 2 2 JP1, JP2 PEC03SAAN Header, Male 3-pin, 100mil spacing, 0.100 inch x 3 PEC03SAAN Sullins

1 1 1 L1** 1.0 µH Inductor, SMT Multi-layer, 3.7A, 3225 DFE322512C1R0 TOKO

34milliohm

1 0 0 U1 TPS61253 IC, TINY 1.5-A 3.5-MHz BOOST BGA TPS61253YFF TI

CONVERTER, 5.0V

0 1 0 U1 TPS61258 IC, TINY 1.5-A 3.5-MHz BOOST BGA TPS61258YFF TI

CONVERTER, 4.5V

0 0 1 U1 TPS61259 IC, TINY 1.5-A 3.5-MHz BOOST BGA TPS61259YFF TI

CONVERTER, 5.1V

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Notes:

1. These assemblies are ESD sensitive, ESD precautions shall be observed.

2. These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.

3. These assemblies must comply with workmanship standards IPC-A-610 Class 2.

4. Ref designators marked with an asterisk ('**') cannot be substituted. All other components can be substituted with equivalent MFG's components.

5. Install label in silkscreened box after final wash. Text shall be 8 pt font. Text shall be per Table 1.

SLVU744–August 2012 TPS6125xEVM-766, 3.5-MHz High Efficiency Step-Up Converter In Chip Scale

Packaging EVM

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