Datasheet

L1
C
IN
C
OUT
GND
GND
V
IN
V
OUT
R
ILIM
R2R1
C
FF
10mm (0.39in)
7mm (0.27in)
TPS61252
SLVSAG3 –SEPTEMBER 2010 www.ti.com
Figure 11. Suggested Layout (Top)
THERMAL INFORMATION
The implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the
power-dissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below:
• Improving the power dissipation capability of the PCB design
– E.g. increase of the GND plane on the top layer which is connected to the exposed thermal pad
– Use thicker cupper layer
• Improving the thermal coupling of the component to the PCB
• Introducing airflow in the system
Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where
high maximum power dissipation exists, special care must be paid to thermal dissipation issues in board design.
The maximum junction temperature (T
J
) of the TPS61252 is 150°C.
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