Datasheet

List of Materials www.ti.com
Figure 16. TPS61251 EVM Bottom Copper (Viewed from Bottom)
7 List of Materials
Table 2 lists the EVM components as configured according to the schematic shown in Figure 1.
Table 2. HPA517A Bill of Material
Count RefDes Value Description Size Part Number MFR
2 C1, C3 4.7 µF Capacitor, Ceramic, 10V, X7R, 10% 0805 GRM21BR71A475KA73 Murata
0 C10 open Capacitor, Aluminum 6032 (C) Std Sanyo
1 C2 1nF Capacitor, Ceramic, 50V, X7R, 10% 0603 Std Std
6 C4, C5, 470 µF Capacitor, Polymer SMT, 6.3V, –25 to +105°C, 7343(D) T520W477M006ATE055 Kemet
C6, C7, ±20%
C8, C9
1 L1 1.5 µH Inductor, SMT, 2.2A, 72mΩ 0.118 X 0.118 inch XFL3012-152ME Coilcraft
2 R1, R4 1.00M Resistor, Chip, 1/16W, 1% 0603 Std Std
1 R2 280k Resistor, Chip, 1/16W, 1% 0603 Std Std
1 R3 20.0k Resistor, Chip, 1/16W, 1% 0603 Std Std
1 U1 TPS61251DSG IC, High Frequency Step-Up Converter, Fixed V
O
QFN TPS61251DSG TI
10
TPS61251 Evaluation Module SLVU409–October 2010
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