Datasheet

TPS61240, TPS61241
SLVS806B –APRIL 2009– REVISED FEBRUARY 2012 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
OUTPUT PACKAGE
DEVICE
PART NUMBER
(1)
PACKAGE ORDERING
SPECIFIC FEATURES
VOLTAGE MARKING
6-WCSP TPS61240YFF GM
TPS61240
6-QFN TPS61240DRV OCJ
Supports 5V, up to 300mA loading
5V
TPS61241 6-WCSP TPS61241YFF NF
down to 3.2V input voltage
Optimized to drive
TPS61242
(2)
6-WCSP TPS61242YFF RY
an inductive load
(1) The YFF package is available in tape on reel. Add R suffix (TPS61240YFFR) to order quantities of 3000 parts per reel. Add a T suffix
(TPS61240YFFT) to order quantities of 250 parts.
(2) Product preview.Contact TI factory for more information
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1) (2)
VALUE UNIT
V
I
Input voltage range on V
IN
, L, EN –0.3 to 7 V
Voltage on V
OUT
–2.0 to 7 V
Voltage on FB –2.0 to 14 V
Peak output current Internally limited A
Human Body Model 4000 V
ESD rating
(3)
CDM Charged Device Model 500 V
Machine Model 200 V
T
J
Maximum operating junction temperature –40 to 125 °C
T
stg
Storage temperature range –65 to 150 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) The human body model is a 100pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200pF
capacitor discharged directly into each pin.
DISSIPATION RATINGS TABLE
(1)
POWER RATING DERATING FACTOR ABOVE
PACKAGE R
θJA
T
A
≤ 25°C T
A
= 25°C
DRV 76°C/W 1300mW 13mW/°C
YFF 125°C/W 800mW 8mW/°C
(1) Maximum power dissipation is a function of T
J
(max), θ
JA
and T
A
. The maximum allowable power dissipation
at any allowable ambient temperature is P
D
= [T
J
(max)-T
A
] / θ
JA
.
(2) This thermal data is measured with high-K board (4 layer board according to JESD51-7 JEDEC standard).
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