Datasheet

5.2 Schematic and Bill of Materials
Board Layout, Schematic, and Bill of Materials www.ti.com
Figure 3. Bottom Layer
Figure 4. TPS61220EVM-319 Schematic
Table 2. Bill of Materials
Count RefDes Value Description Size Part Number MFR
2 C1, C2 10 µ F Capacitor, Ceramic, 6.3 V, X5R, 20% 0603 GRM188R60J106ME47D Murata
4 J1, J3, PTC02SAAN Header, Male 2-pin, 100-mil spacing 0.100 × 2 in. (2,54 x PTC02SAAN Sullins
J4, J6 50,80 mm)
0 J2, J5 Open Header, Male 2-pin, 100-mil spacing 0.100 × 2 in. (2,54 x Open Sullins
50,80 mm)
1 JP1 PTC03SAAN Header, 3-pin, 100-mil spacing 0.100 × 3 in. (2,54 x PTC03SAAN Sullins
76,20 mm)
1 L1 4.7 µ H Inductor Power, SMT, DCR 145 m Ω , 550 mA 0.110 x 0.118 in. EPL3015-472ML Coilcraft
(2,79 x 2,99 mm)
1 R1 1.00M Resistor, Chip, 1/16 W, 1% 0603 Std Std
1 R2 178k Resistor, Chip, 1/16 W, 1% 0603 Std Std
1 U1 TPS61220DCK IC, Tiny Low Input Voltage Boost Converter SC-70 TPS61220DCK TI
1 — — Shunt, 100 mil, Black 0.100 in. (2,54 mm) 929950-00 3M
1 HPA319 PCB 0.9 × 1.7 × 0.062 in. HPA319 Any
(22,86 x 43,18 x
1,57 mm)
4 TPS61220EVM-319 SLVU253 – February 2009
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