Datasheet

4 Bill of Materials and Schematic
4.1 Bill of Materials
Bill of Materials and Schematic www.ti.com
This section provides the TPS61170EVM-316 bill of materials and schematic.
Table 2. HPA316A Bill of Materials
(1) (2) (3)
COUNT RefDes
(4)
Value Description Size Part Number MFR
1 C1 4.7uF Capacitor, Ceramic, 25V, X5R, 10% 0805 TMK212BJ475KG-T Taiyo
Yuden
1 C2 0.022uF Capacitor, Ceramic, 25V, X5R, 10% 0603 Std muRata
2 C3, C4 2.2uF Capacitor, Ceramic, 25V, X5R, 20% 0805 Std Std
0 C5, C6 Open Capacitor, Ceramic 0603
1 C7 1.0uF Capacitor, Ceramic, 50V, X5R, 10% 0805 Std Taiyo
Yuden
1 D1 MBRA140T3 Diode, Schottky, 1-A, 40-V SMA MBRA140T3 Motorola
4 J1, J2, J3, PTC36SAAN Header, 2 pin, 100mil spacing, (36-pin 0.100 inch x 2 PTC36SAAN Sullins
J4 strip)
1 J5 2510-6002UB Connector, Male Straight 2x5 pin, 100mil 0.338 x 0.788 inch 2510-6002UB 3M
spacing, 4 Wall
1 JP1 PTC36SAAN Header, 2 pin, 100mil spacing, (36-pin 0.100 inch x 2 PTC36SAAN Sullins
strip)
1 L1 22uH Inductor, SMT, 1.6A, 0.11milliohm 0.300 x 0.300 DRQ73-220 Coiltronics
1 R1 4.99k Resistor, Chip, 1/16W, 1% 0603 Std Std
1 R2 280k Resistor, Chip, 1/16W, 1% 0603 Std Std
1 R3 31.6k Resistor, Chip, 1/16W, 1% 0603 Std Std
0 R4 Open Resistor, Chip, 1/16W, 1% 0603
1 R5 1.82k Resistor, Chip, 1/16W, 1% 0603 Std Std
1 R6 49.9 Resistor, Chip, 1/16W, 1% 0603 Std Std
1 TP1 5000 Test Point, Red, Thru Hole Color Keyed 0.100 x 0.100 inch 5000 Keystone
1 U1 TPS61170DRV IC,1.2 MHz/1A PWM SON-6 TPS61170DRV TI
1 -- -- PCB, 1.65 In x 1.45 In x 0.062 In HPA316 Any
1 -- -- Shunt, 100 mil, Black 0.100 929950-00 3M
(1)
These assemblies are ESD sensitive, ESD precautions shall be observed.
(2)
These assemblies must be clean and free from flux and all contaminants.
Use of no clean flux is not acceptable.
(3)
These assemblies must comply with workmanship standards IPC-A-610 Class 2.
(4)
Ref designators marked with an asterisk ('**') cannot be substituted.
All other components can be substituted with equivalent MFG's components.
12 TPS61170EVM-316 SLVU250A – July 2008 – Revised September 2008
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