Datasheet
VIN
CTRL
SW
FB
COMP
GND
TOP VIEW
Thermal
Pad
6-PIN2mmx2mmx0.8mmQFN
TPS61170
SLVS789C – NOVEMBER 2007– REVISED APRIL 2011
www.ti.com
ELECTRICAL CHARACTERISTICS (continued)
VIN = 3.6 V, CTRL = VIN, T
A
= –40°C to 85°C, typical values are at T
A
= 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
EasyScale TIMING
t
start
Start time of program stream 2 μs
t
EOS
End time of program stream 2 360 μs
t
H_LB
High time low bit Logic 0 2 180 μs
t
L_LB
Low time low bit Logic 0 2 × t
H_LB
360 μs
t
H_HB
High time high bit Logic 1 2 × t
L_HB
360 μs
t
L_HB
Low time high bit Logic 1 2 180 μs
V
ACKNL
Acknowledge output voltage low Open drain, R
pullup
=15 kΩ to Vin 0.4 V
t
valACKN
Acknowledge valid time See
(2)
2 μs
t
ACKN
Duration of acknowledge condition See
(2)
512 μs
THERMAL SHUTDOWN
T
shutdown
Thermal shutdown threshold 160 °C
T
hysteresis
Thermal shutdown threshold hysteresis 15 °C
(2) Acknowledge condition active 0, this condition will only be applied if the RFA bit is set. Open drain output, line needs to be pulled high
by the host with resistor load.
PIN ASSIGNMENTS
TERMINAL FUNCTIONS
TERMINAL
I/O DESCRIPTION
NAME NO.
VIN 6 I The input supply pin for the IC. Connect VIN to a supply voltage between 3 V and 18 V.
SW 4 I This is the switching node of the IC. Connect SW to the switched side of the inductor.
GND 3 O Ground
FB 1 I Feedback pin for current. Connect to the center tap of a resistor divider to program the output voltage.
Output of the transconductance error amplifier. Connect an external RC network to this pin to compensate
COMP 2 O
the regulator.
Control pin of the boost regulator. CTRL is a multi-functional pin which can be used to enable the device
CTRL 5 I
and control the feedback voltage with a PWM signal or for digital communications.
The thermal pad should be soldered to the analog ground plane to avoid thermal issue. If possible, use
Thermal Pad
thermal vias to connect to ground plane for ideal power dissipation.
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