Datasheet

D1
VIN SW
FB
GND
CTRL
COMP
C3
680 pF
TPS 61170
L1
10 Hm
C1
4.7 Fm
C2
4.7 Fm
R1
185.1 kW
R2
10 kW
R3
10 kW
L1: TOKO#A915_Y-100M
C1: Murata GRM21BR61E475K
C2: Murata GRM32ER71H475K
D1:
ONsemi MBR0540T1
VIN 12 V
VOUT 24 V/ 300 mA
VIN5V
D1
VIN SW
FB
GND
CTRL
COMP
C3
680pF
TPS 61170
ON/ OFF
ProgramFB
L1
10 Hm
R1
87.6kW
R2
10kW
R3
10kW
C1
4.7 Fm
VOUT 12V/300mA
C2
4.7 Fm
L1: TOKO#A915_Y-100M
C1:MurataGRM188R61A475K
C2:MurataGRM21BR61E475K
D1:
ONsemiMBR0540T1
TPS61170
www.ti.com SLVS789C – NOVEMBER 2007– REVISED APRIL 2011
The TPS61170 comes in a thermally enhanced QFN package. This package includes a thermal pad that
improves the thermal capabilities of the package. The R
θJA
of the QFN package greatly depends on the PCB
layout and thermal pad connection. The thermal pad must be soldered to the analog ground on the PCB. Using
thermal vias underneath the thermal pad as illustrated in the layout example. Also see the QFN/SON PCB
Attachment application report (SLUA271).
ADDITIONAL TYPICAL APPLICATIONS
Figure 19. 12V to 24V DCDC Power Conversion
Figure 20. 5V to 12V DCDC Power Conversion With Programmable Feedback Reference Voltage
Copyright © 2007–2011, Texas Instruments Incorporated 19