Datasheet

VIN
CTRL
SW
FB
COMP
GND
TOP VIEW
Thermal
Pad
6-PIN2mmx2mmx0.8mmQFN
TPS61160
TPS61161
SLVS791C NOVEMBER 2007REVISED APRIL 2012
www.ti.com
ELECTRICAL CHARACTERISTICS (continued)
VIN = 3.6 V, CTRL = VIN, T
A
= –40°C to 85°C, typical values are at T
A
= 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
EasyScale TIMING
t
start
Start time of program stream 2 μs
t
EOS
End time of program stream 2 360 μs
t
H_LB
High time low bit Logic 0 2 180 μs
t
L_LB
Low time low bit Logic 0 2 × t
H_LB
360 μs
t
H_HB
High time high bit Logic 1 2 × t
L_HB
360 μs
t
L_HB
Low time high bit Logic 1 2 180 μs
V
ACKNL
Acknowledge output voltage low Open drain, R
pullup
=15 k to VIN 0.4 V
t
valACKN
Acknowledge valid time See
(2)
2 μs
t
ACKN
Duration of acknowledge condition See
(2)
512 μs
THERMAL SHUTDOWN
T
shutdown
Thermal shutdown threshold 160 °C
T
hysteresis
Thermal shutdown threshold hysteresis 15 °C
(2) Acknowledge condition active 0, this condition will only be applied in case the RFA bit is set. Open drain output, line needs to be pulled
high by the host with resistor load.
DEVICE INFORMATION
TERMINAL FUNCTIONS
TERMINAL
I/O DESCRIPTION
NAME NO.
VIN 6 I The input supply pin for the IC. Connect VIN to a supply voltage between 2.7V and 18V.
This is the switching node of the IC. Connect the inductor between the VIN and SW pin. This pin is also
SW 4 I
used to sense the output voltage for open LED protection
GND 3 O Ground
FB 1 I Feedback pin for current. Connect the sense resistor from FB to GND.
Output of the transconductance error amplifier. Connect an external capacitor to this pin to compensate the
COMP 2 O
converter.
Control pin of the boost converter. It is a multi-functional pin which can be used for enable control, PWM
CTRL 5 I
and digital dimming.
The thermal pad should be soldered to the analog ground plane. If possible, use thermal via to connect to
Thermal Pad
ground plane for ideal power dissipation.
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