Datasheet

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DEVICE INFORMATION
1
2
3
4
5
10
9
8
7
6
IFB1
ISET
SEL1
SEL2
VIN
IFB2
ISET2
GND
IOUT
SW
QFNPACKAGE
(TOP VIEW)
Exposed
Thermal
Pad
TPS61150A
SLVS706 – OCTOBER 2006
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
(1)
T
A
PACKAGE OVP (Typ.) PACKAGE MARKING
–40 to 85 ° C TPS61150ADRCR 28V BTK
–40 to 85 ° C TPS61150ADRCT 28V BTK
(1) For the most current package and ordering information, see the Package Option Addendum at the end
of this document, or see the TI website at www.ti.com .
TERMINAL FUNCTIONS
TERMINAL
I/O DESCRIPTION
NAME NO.
Input pin. VIN provides the current to the boost power stage, and also powers the IC circuit. When VIN is
VIN 5 I below the undervoltage lockout threshold, the IC turns off and disables outputs; thereby disconnecting the
WLEDs from the input.
GND 8 O Ground. Connect the input and output capacitors as close as possible to this pin.
SW 6 I Switching node of the IC.
IOUT 7 O Constant current supply output. IOUT is directly connected to the boost converter output.
Return path for the IOUT regulation. The current regulator is connected to this pin, and it can be disabled
IFB1, IFB2 10 I
to open the current path.
ISET1, 2
I Output current programming. The resistor connected to the pin programs the corresponding output current.
ISET2 9
SEL1, 3
I Mode selection. See Table 1 for details.
SEL2 4
The thermal pad should be soldered to the analog ground. If possible, use the thermal pad to connect to
Thermal Pad
ground plane for ideal power dissipation.
Table 1. TPS61150A Mode Selection
SEL1 SEL2 IFB1 IFB2
H L Enable Disable
L H Disable Enable
H H Enable Enable
L L IC Shutdown
2
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