Datasheet

TPS61097
SLVS872C –JUNE 2009– REVISED DECEMBER 2011 www.ti.com
Figure 20. PCB Top View
Thermal Information
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the
power-dissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below.
• Improving the power dissipation capability of the PCB design
• Improving the thermal coupling of the component to the PCB
• Introducing airflow in the system
The maximum recommended junction temperature (T
J
) of the TPS61097 devices is 125°C. Specified regulator
operation is assured to a maximum ambient temperature T
A
of 85°C. Therefore, the maximum power dissipation
is about TBD mW. More power can be dissipated if the maximum ambient temperature of the application is
lower.
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