Datasheet

8 Bill of Materials
www.ti.com Bill of Materials
Table 2 lists the EVM components as configured according to the schematic shown in Figure 1 .
Table 2. TPS61093EVM Bill of Materials
Count RefDes Value Description Size Part Number MFR
1 C1 4.7 µ F Capacitor, Ceramic, 6.3V, X5R, 20% 0603 Std Std
1 C2 0.1 µ F Capacitor, Ceramic, 25V, X5R, 20% 0603 Std Std
1 C3 0.1 µ F Capacitor, Ceramic, 6.3V, X5R, 20% 0603 Std Std
1 C4 1 µ F Capacitor, Ceramic, 25V, X5R, 20% 0603 Std Std
1 C5 1 µ F Capacitor, Ceramic, 6.3V, X5R, 20% 0603 Std Std
0 C6 Open Capacitor, Ceramic, 6.3V, X5R, 20% 0603 Std Std
0 J2, J5, J8 Open Header, Male 2-pin, 100mil spacing 0.100 inch x 2 PEC02SAAN Sullins
6 J1, J3, J4, J6, PEC02SAAN Header, Male 2-pin, 100mil spacing, 0.100 inch x 2 PEC02SAAN Sullins
J7, J9
1 JP1 PEC02SAAN Header, 2-pin, 100mil spacing Inductor, 0.100 inch x 2 PEC02SAAN Sullins
1 L1 10uH SMT, 1.4A, 127 milliohm 0.189 x 0.189 inch LPS5030-103ML Coilcraft
1 R1 294k Resistor, Chip, 1/16W, 1% 0603 Std Std
1 R2 10.2k Resistor, Chip, 1/16W, 1% 0603 Std Std
0 R3 Open Resistor, Chip, 1/16W, 1% 0603 Std Std
1 R4 0 Resistor, Chip, 1/16W, 1% 0603 Std Std
1 R5 200k Resistor, Chip, 1/16W, 1% 0603 Std Std
0 TP1 Open Test Point, Red, Thru Hole Color Keyed 0.100 x 0.100 inch 5000 Keystone
1 U1 TPS61093DSK IC, Low Input Boost Converter with Integrated QFN TPS61093DSK TI
Power Diode and Isolation
1 — Shunt, 100-mil, Black 0.100 929950-00 3M
1 PCB 2.0"x 2.0"x 0.062" HPA519 Any
SLVU327 – October 2009 TPS61093EVM-519 User's Guide 11
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