Datasheet

FB
VO
SW
OUT
SS
CP1
GND
VIN
EN
TOP VIEW
CP2
6
10
5
1
Thermal
Pad
10-PIN2.5mmx2.5mmQFN
TPS61093
SLVS992A –SEPTEMBER 2009–REVISED NOVEMBER 2009 www.ti.com
DEVICE INFORMATION
PIN ASSIGNMENTS
PIN FUNCTIONS
PIN
I/O DESCRIPTION
NAME NO.
VIN 2 I IC Supply voltage input.
VO 10 O Output of the boost converter. When the output voltage exceeds the over voltage protection (OVP)
threshold, the power switch turns off until VO drops below the over voltage protection hysteresis.
OUT 8 O Isolation switch is between this pin and VO pin. Connect load to this pin for input/output isolation during
IC shutdown. See WITHOUT ISOLATION FET for the tradeoff between isolation and efficiency.
GND 1 – Ground of the IC.
CP1, CP2 3, 4 Connect to flying capacitor for internal charge pump.
EN 5 I Enable pin (HIGH = enable). When the pin is pulled low for 1 ms, the IC turns off and consumes less
than 1-μA current.
SS 6 I Soft start pin. A RC network connecting to the SS pin programs soft start timing. See START UP.
FB 7 I Voltage feedback pin for output regulation, 0.5-V regulated voltage. An external resistor divider
connected to this pin programs the regulated output voltage.
SW 9 I Switching node of the IC where the internal PWM switch operates.
Thermal Pad – – It should be soldered to the ground plane. If possible, use thermal via to connect to ground plane for
ideal power dissipation.
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