Datasheet

C5
0.1 µF
DS1
C6
1 µ
F
V
CC2
~−V
CC
Unregulated
AuxiliaryOutput
SW
C1
Power
Supply
L1
VBAT
VOUT
FB
C2
EN
GND
TPS6107x
ListofComponents:
U1= TPS61070DDC
L1=
4.7µHWurthElektronik744031004
C1=2x4.7
µF
,0603,X7R/X5RCeramic
C2=2x4.7
µF
,0603,X7R/X5RCeramic
V
CC
BoostOutput
R1
R2
THERMAL INFORMATION
P
D(MAX)
+
T
J(MAX)
* T
A
R
qJA
+
125°C * 85°C
130 °CńW
+ 308 mW
(8)
TPS61070 , TPS61071
TPS61072 , TPS61073
SLVS510C – JULY 2006 – REVISED MARCH 2009 .......................................................................................................................................................... www.ti.com
Figure 28. Power Supply Solution With Auxiliary Negative Output Voltage
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the
power-dissipation limits of a given component.
Three basic approaches for enhancing thermal performance follow.
• Improving the power dissipation capability of the PCB design
• Improving the thermal coupling of the component to the PCB
• Introducing airflow in the system
The maximum recommended junction temperature (T
J
) of the TPS6107x devices is 125 ° C. The thermal
resistance of the 6-pin thin SOT package (DDC) is R
Θ JA
= 130 ° C/W. Specified regulator operation is assured to a
maximum ambient temperature T
A
of 85 ° C. Therefore, the maximum power dissipation is about 308 mW. More
power can be dissipated if the maximum ambient temperature of the application is lower.
18 Submit Documentation Feedback Copyright © 2006 – 2009, Texas Instruments Incorporated
Product Folder Link(s): TPS61070 TPS61071 TPS61072 TPS61073