Datasheet

SW
C1
10 µF
L1
6.8 µH
R1
R2
VBAT
VOUT
R6
C2
2.2 µF
C3
220 µF
LBO
PGND
LBI
SYNC
EN
GND
TPS61032
List of Components:
U1 = TPS6103xPWP
L1 = Sumida CDRH124–6R8
C1, C2, C5, C6 = X7R,X5R Ceramic
C3 = Low ESR Tantalum
DS1 = BAT54S
LBO
C5
0.1 µF
DS1
C6
1 µF
V
CC2
–5 V
Unregulated
Auxiliary Output
Battery
Input
FB
V
CC1
5 V
Boost Main Output
P
D(MAX)
+
T
J(MAX)
* T
A
R
qJA
+
125°C * 85°C
36.5°CńW
TPS61030
TPS61031, TPS61032
www.ti.com SLUS534E – SEPTEMBER 2002– REVISED JANUARY 2012
Figure 21. Power Supply Solution With Auxiliary Negative Output Voltage
THERMAL INFORMATION
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the
power-dissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below:
• Improving the power dissipation capability of the PCB design
• Improving the thermal coupling of the component to the PCB
• Introducing airflow in the system
The maximum junction temperature (T
J
) of the TPS6103x devices is 125°C. The thermal resistance of the 16-pin
TSSOP PowerPAD package (PWP) is R
ΘJA
= 36.5 °C/W (QFN package, RSA, 38.1 °C/W), if the PowerPAD is
soldered. Specified regulator operation is assured to a maximum ambient temperature T
A
of 85°C. Therefore, the
maximum power dissipation for the PWP package is about 1096 mW, for the RSA package it is about 1050 mW.
More power can be dissipated if the maximum ambient temperature of the application is lower.
(9)
Copyright © 2002–2012, Texas Instruments Incorporated 17