Datasheet

P
D(MAX)
+
T
J(MAX)
* T
A
R
qJA
+
125°C * 85°C
48.7 °CńW
+ 820 mW
TPS61025-Q1
TPS61027-Q1
TPS61029-Q1
SLVSA31 –NOVEMBER 2009 www.ti.com
THERMAL INFORMATION
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the
power-dissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below.
• Improving the power dissipation capability of the PCB design
• Improving the thermal coupling of the component to the PCB
• Introducing airflow in the system
The maximum recommended junction temperature (T
J
) of the TPS6102x devices is 125°C. The thermal
resistance of the 10-pin QFN 3 × 3 package (DRC) is R
ΘJA
= 48.7°C/W, if the PowerPAD is soldered. Specified
regulator operation is assured to a maximum ambient temperature T
A
of 85°C. Therefore, the maximum power
dissipation is about 820 mW. More power can be dissipated if the maximum ambient temperature of the
application is lower.
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