Datasheet

Circuit Description and Schematic
2-2
2.1 Circuit Description and Schematic
For all necessary signals there are single-pin connectors on the board. To
operate the board, connect a power source with the appropriate voltage level
between VIN and GND.
Some additional GND-pins have been added for your convenience.
C1 to C4 are 1206-size SMD-footprints. These parts are not necessary for
operation and have only been added for test purposes. They can be used as
test points or to easily increase the value of a capacitor by adding another one
in parallel.
Figure 2–1. Typical Application Circuit Schematic
VIN
C3
1 µF
C2
1 µF
CP2+
CP2–
GND
VOUT
CP1+
CP1–
ENABLE
6
8
3
4
1
7
5
2
IC1
3
2
1
C1
n,u.
X1
X2
X3
X4
VIN
GND
TPS60241
C6
2.2 µF
C4
n.u.
X5
X6
X7
X8
VOUT
GND
GND
GND
GND
Enable
J1
C5
2.2 µF
INPUT OUTPUT
Table 2–1.Bill of Materials
Reference Part Description
X1 to X8 MC S1-B Connector
J1 Jumper Enable
IC1 TPS60241DGK Buck-boost converter
C5 2.2 µF/10 V; X7R ceramic capacitor size 0805 Input capacitor
C2, C3 1 µF/10 V; X7R ceramic capacitor size 0805 Flying capacitor
C6 2.2 µF/10 V; X7R ceramic capacitor size 0805 Output capacitor
C1, C4 Additional footprints for input- and output-capacitor; size 1206
2.2 Layout of the EVM
Figure 2–2 shows the placement of the components of the EVM. Components
are only placed on the top layer of the board. The size of the EVM is 51.0 ×
35.5 mm
2
that is 1810 mm
2,
which is much larger than required for the IC and
its capacitors.