Datasheet

   
       
 
SLVS258A − NOVEMBER 1999 − REVISED DECEMBER 1999
18
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
board layout
Careful board layout is necessary due to the high transient currents and switching frequency of the converter.
All capacitors should be soldered in close proximity to the IC. Connect ground and power ground pins through
a short, low-impedance trace. A PCB layout proposal for a two-layer board is given in Figure 23. The bottom
layer of the board carries only ground potential for best performance. The layout also provides improved thermal
performance as the exposed lead frame is soldered to the PCB.
An evaluation module for the TPS60130 is available and can be ordered under product code
TPS60130EVM-143. The EVM uses the layout shown in Figure 23.
Figure 23. Recommended PCB Layout for
TPS6013X
Figure 24. Component Placement for
TPS6013X EVM
Table 5. Component Identification
IC1 TPS6013x
C1, C2 Flying capacitors
C3, C6 Input capacitors
C4, C5 Onput capacitors
C7 Stabilization capacitor for LBI
R1, R2 Resistive divider for LBI
R3 Pullup resistor for LBO
The best performance of the converter is achieved with the additional bypass capacitors C5 and C6 at input and
output. Capacitor C7 should be included if the large line transients are expected. The capacitors are not
required. They can be omitted in most applications.