Datasheet

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   
SLVS215C − JUNE 1999 − REVISED AUGUST 2008
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings (unless otherwise noted)
†‡
Input voltage range, V
I
(IN, OUT, ENABLE, SKIP, COM, CLK, FB, SYNC) −0.3 V to 5.5 V. . . . . . . . . . . . . . . .
Differential input voltage, V
ID
(C1+, C2+ to GND) −0.3 V to (V
O
+ 0.3 V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Differential input voltage, V
ID
(C1−, C2− to GND) −0.3 V to (V
IN
+ 0.3 V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous total power dissipation See Dissipation Rating Tables. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current 400 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
stg
−55°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10s 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum junction temperature, T
J
150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
‡
V
ENABLE
, V
SKIP
, V
COM
, V
CLK
and V
SYNC
can exceed V
IN
up to the maximum rated voltage without increasing the leakage current
drawn by these mode select inputs.
PACKAGE DISSIPATION RATINGS
PACKAGE
T
A
≤
25
°
C
DERATING FACTOR
§
T
A
= 70
°
C
T
A
= 85
°
C
PACKAGE
T
A
≤ 25 C
POWER RATING
DERATING FACTOR
ABOVE T
A
= 25°C
§
T
A
= 70 C
POWER RATING
T
A
= 85 C
POWER RATING
PWP 3 W 30.3 mW/°C 1.66 W 1.21 W
§
The thermal resistance junction to ambient of the 20-pin TSSOP PowerPAD package R
θJA
= 33°C/W
(soldered PowerPAD using thermal vias). PowerPAD packages are modeled and tested using PWB
boards recommended in the PowerPAD Application Report, SLMA0002. PowerPAD packages are
designed for board mounting with the die pad soldered to a copper pad patterned on the board.