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www.ti.com EVM Assembly Drawings and PCB layout
Figure 91. TPS51916 Thermal
Test condition: 12Vin, 1.2 V/15 A, no airflow
9 EVM Assembly Drawings and PCB layout
The following figures (Figure 92 through Figure 101) show the design of the TPS59640EVM-751
printed-circuit board. The EVM has been designed using an eight-layer circuit board with 2 oz o0f copper
on outside layers.
Figure 92. TPS59640EVM-751 Top Layer Assembly Drawing (Top View)
53
SLUU796– January 2012 Using the TPS59640EVM-751 IMVP-7, 3-Phase CPU/1-Phase GPU SVID
Power System
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