Datasheet

TPS57112-Q1
www.ti.com SLVSAL8 –DECEMBER 2010
THERMAL INFORMATION
TPS57112-Q1
THERMAL METRIC
(1)(2)(3)
(RTE) UNITS
(QFN-16) PINS
q
JA
Junction-to-ambient thermal resistance 56.4
q
JA
Junction-to-ambient thermal resistance
(4)
37
y
JT
Junction-to-top characterization parameter 0.9
y
JB
Junction-to-board characterization parameter 22.2 °C/W
q
JC(top)
Junction-to-case(top) thermal resistance 28.7
q
JC(bottom)
Junction-to-case(bottom) thermal resistance 12.5
q
JB
Junction-to-board thermal resistance 22.7
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) Maximum power dissipation may be limited by overcurrent protection
(3) Power rating at a specific ambient temperature T
A
should be determined with a junction temperature of 150°C. This is the point where
distortion starts to substantially increase. Thermal management of the PCB should strive to keep the junction temperature at or below
150°C for best performance and long-term reliability. See power dissipation estimate in application section of this data sheet for more
information.
(4) Test boards conditions:
(a) 2 inches x 2 inches, 4 layers, thickness: 0.062 inch
(b) 2 oz. copper traces located on the top of the PCB
(c) 2 oz. copper ground planes on the 2 internal layers and bottom layer
(d) 4 thermal vias (10mil) located under the device package
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