Datasheet

6 EVM Assembly Drawings and Layout
www.ti.com EVM Assembly Drawings and Layout
Figure 11 through Figure 16 show the designs of the TPS55386EVM-363 printed circuit board. The EVM
has been designed using a 4-Layer, 2oz copper-clad circuit board 3.0” × 3.0” with all components in a
1.15” × 2.15” active area on the top side and all active traces to the top and bottom layers to allow the
user to easily view, probe and evaluate the TPS55386 control IC in a practical double-sided application.
Moving components to both sides of the PCB or using additional internal layers can offer additional size
reduction for space constrained systems
Figure 11. TPS55386EVM-363 Component Placement (Viewed from Top)
Figure 12. TPS55386EVM-363 Silkscreen (Viewed from Top)
SLVU273 – September 2008 Using the TPS55386EVM-363 A 12V Input, 5.0V & 3.3V Output, 3A Non-Synchronous Buck Converter 15
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