Datasheet

TPS55340
SLVSBD4B –MAY 2012–REVISED OCTOBER 2012 www.ti.com
THERMAL INFORMATION
TPS55340
THERMAL METRIC
(1)
UNITS
QFN (16-PINS) HTSSOP (14-
PINS)
θ
JA
Junction-to-ambient thermal resistance 43.3 43.2
θ
JCtop
Junction-to-case (top) thermal resistance 38.7 33.3
θ
JB
Junction-to-board thermal resistance 14.5 28.3
°C/W
ψ
JT
Junction-to-top characterization parameter 0.4 1.3
ψ
JB
Junction-to-board characterization parameter 14.5 28.1
θ
JCbot
Junction-to-case (bottom) thermal resistance 3.5 3.9
space
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
RECOMMENDED OPERATING CONDITIONS
MIN NOM MAX UNIT
V
IN
Input voltage range 2.9 32 V
V
OUT
Output voltage range V
IN
38 V
V
EN
EN voltage range 0 32 V
V
SYN
External switching frequency logic input range 0 5 V
T
A
Operating free-air temperature –40 125 °C
T
J
Operating junction temperature –40 150 °C
ELECTRICAL CHARACTERISTICS
Vin=5V, T
J
= –40°C to +150°C, unless otherwise noted. Typical values are at T
A
= 25°C.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY CURRENT
V
IN
Input voltage range 2.9 32 V
I
Q
Operating quiescent current into Vin Device non-switching, V
FB
= 2 V 0.5 mA
I
SD
Shutdown current EN = GND 2.7 10 µA
V
UVLO
Under-voltage lockout threshold V
IN
falling 2.5 2.7 V
V
hys
Under-voltage lockout hysteresis 120 140 160 mV
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