Datasheet

Thermal
Pad
(17)
FAULT
BOOT
PH
SS
RT/CLK
EN
GND
VIN
VSENSE
COMP
15 14 13
GND
12
11
10
9
8765
4
3
2
16
GND
VIN
VIN
PH
PH
1
TPS55010
SLVSAV0A –APRIL 2011–REVISED JUNE 2011 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
PIN CONFIGURATION
RTE PACKAGE
(TOP VIEW)
Table 1. PIN FUNCTIONS
Pin Name Number Description
VIN 1, 2, 16 Supplies the control circuitry and switches of the power converter.
GND 3, 4, 5 Power Ground. This pin should be electrically connected directly to the thermal pad under the IC.
VSENSE 6 Inverting node of the gm error amplifier.
Error amplifier output, and input to the output switch current comparator. Connect frequency
COMP 7
compensation components to this pin.
Resistor Timing and External Clock. An internal amplifier holds this pin at a fixed voltage when
using an external resistor to ground to set the switching frequency. If the pin is pulled above the
PLL upper threshold, a mode change occurs and the pin becomes a synchronization input. The
RT/CLK 8
internal amplifier is disabled and the pin is a high impedance clock input to the internal PLL. If
clocking edges stop, the internal amplifier is re-enabled and the mode returns to a resistor set
function.
SS 9 Slow-start. An external capacitor connected to this pin sets the output rise time.
PH 10, 11, 12 The source of the internal high side power MOSFET, and drain of the internal low side MOSFET.
A bootstrap capacitor is required between BOOT and PH. If the voltage on this capacitor is below
BOOT 13 the minimum required by the output device, the output is forced to switch off until the capacitor is
refreshed.
An open drain output. Active low if the output voltage is low due to thermal shutdown, dropout,
FAULT 14
overvoltage or EN shut down.
Enable pin, internal pull-up current source. Pull below 1.2V to disable. Float to enable. Adjust the
EN 15
input undervoltage lockout with two resistors.
GND pin should be connected to the exposed thermal pad for proper operation. This thermal pad
THERMAL PAD 17 should be connected to any internal PCB ground plane using multiple vias for good thermal
performance.
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