Datasheet

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SLVS433ASEPTEMBER 2002 − REVISED FEBRUARY 2005
www.ti.com
9
OPERATING FREQUENCY
In the application circuit, the RT pin is grounded through a
71.5-k resistor (R6) to select the operating frequency of
700 kHz. To set a different frequency, place a 68-k to
180-k resistor between RT (pin 28) and analog ground or
leave RT floating to select the default of 350 kHz. The
resistance can be approximated using the following
equation:
R +
500 kHz
Switching Frequency
100 [kW]
OUTPUT FILTER
The output filter is composed of a 0.65-µH inductor (L1)
and 3 x 22-µF capacitors (C5, C7 and C8). The inductor is
a low dc resistance (.017 ) type, Pulse PA0277 0.65 µH.
The capacitors used are 22-µF, 6.3-V ceramic types with
X5R dielectric. An additional high frequency bypass
capacitor, C13 is also used.
PRECHARGE CIRCUIT
VIN precharges the output of the application circuit
through series diodes (D1 and D2) during start-up. As
the input voltage increases at start-up, the output is
precharged to VIN minus the forward bias voltage of the
two diodes. When the internal reference has ramped up
to a value greater than the voltage fed back to the
VSENSE pin, the output of the internal error amplifier
begins to increase. When this output reaches the
maximum ramp amplitude, the output of the PWM
comparator reaches 100 percent duty cycle and the
internal logic enables the high-side FET driver and
switching begins. The output tracks the internal
reference until the preset output voltage is reached.
Under no circumstances should the precharge voltage
be allowed to increase above the preset output value.
PCB LAYOUT
Figure 11 details a generalized PCB layout guide for the
TPS54673. The VIN pins should be connected together on
the printed circuit board (PCB) and bypassed with a low
ESR ceramic bypass capacitor. Care should be taken to
minimize the loop area formed by the bypass capacitor
connections, the VIN pins, and the TPS54673 ground
pins. The minimum recommended bypass capacitance is
10 µF ceramic with a X5R or X7R dielectric and the
optimum placement is closest to the VIN pins and the
PGND pins.
The TPS54673 has two internal grounds (analog and
power). The analog ground ties to all of the noise sensitive
signals, while the power ground ties to the noisier power
signals. Noise injected between the two grounds can
degrade the performance of the TPS54673, particularly at
higher output currents. Ground noise on an analog ground
plane can also cause problems with some of the control
and bias signals. For these reasons, separate analog and
power ground traces are recommended. There should be
an area of ground on the top layer directly under the IC,
with an exposed area for connection to the PowerPAD.
Use vias to connect this ground area to any internal ground
plane. Use additional vias at the ground side of the input
and output filter capacitors as well. The AGND and PGND
pins should be tied to the PCB ground by connecting them
to the ground area under the device as shown. The only
components that should tie directly to the power ground
plane are the input capacitors, the output capacitors, the
input voltage decoupling capacitor, and the PGND pins of
the TPS54673. Use a separate wide trace for the analog
ground signal path. This analog ground should be used for
the voltage set point divider, timing resistor RT, slow start
capacitor, and bias capacitor grounds. Connect this trace
directly to AGND (Pin 1).
The PH pins should be tied together and routed to the
output inductor. Since the PH connection is the switching
node, the inductor should be located very close to the PH
pins and the area of the PCB conductor minimized to
prevent excessive capacitive coupling.
Connect the boot capacitor between the phase node and
the BOOT pin as shown. Keep the boot capacitor close to
the IC and minimize the conductor trace lengths.
Connect the output filter capacitor(s) as shown between
the VOUT trace and PGND. It is important to keep the loop
formed by the PH pins, Lout, Cout and PGND as small as
practical.
Place the compensation components from the VOUT trace
to the VSENSE and COMP pins. Do not place these
components too close to the PH trace. Due to the size of
the IC package and the device pinout, the components will
have to be routed somewhat close, but maintain as much
separation as possible while still keeping the layout
compact.
Connect the bias capacitor from the VBIAS pin to analog
ground using the isolated analog ground trace. If a
slow−start capacitor or RT resistor is used, or if the SYNC
pin is used to select 350 kHz operating frequency, connect
them to this trace as well.
If pre−charge diodes are used, keep the path from the
voltage source to the output filter capacitor short. Make
sure the etch is wide enough to carry the pre−charge
current.
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