Datasheet
SLVS397C − JULY 2001 − REVISED FEBRUARY 2005
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2
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during
storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
T
A
REFIN VOLTAGE PACKAGE PART NUMBER
−40°C to 85°C 0.2 V to 1.75 V Plastic HTSSOP (PWP)
(1)
TPS54672PWP
(1)
The PWP package is also available taped and reeled. Add an R suffix to the device type (i.e., TPS54672PWPR). See the application section
of the data sheet for PowerPAD drawing and layout information.
(2)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website
at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
(1)
TPS54672
VIN, ENA −0.3 V to 7 V
Input voltage range, V
I
RT −0.3 V to 6 V
Input voltage range, V
I
VSENSE, REFIN −0.3 V to 4 V
BOOT −0.3 V to 17 V
Output voltage range, V
O
VBIAS, COMP, STATUS −0.3 V to 7 V
Output voltage range, V
O
PH −0.3 V to 10 V
Source current, I
O
PH Internally Limited
Source current, I
O
COMP, VBIAS 6 mA
PH 12 A
Sink current, I
S
COMP 6 mA
Sink current, I
S
STATUS 10 mA
Voltage differential, AGND to PGND ±0.6 V
Operating virtual junction temperature range, T
J
−40°C to 125°C
Storage temperature, T
stg
−65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 300°C
(1)
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATINGS
(1)(2)
PACKAGE
THERMAL IMPEDANCE
JUNCTION-TO-AMBIENT
T
A
=25°C
POWER RATING
T
A
= 70°C
POWER RATING
T
A
= 85°C
POWER RATING
28 Pin PWP with solder 18.2 °C/W 5.49 W
(3)
3.02 W 2.20 W
28 Pin PWP without solder 40.5 °C/W 2.48 W 1.36 W 0.99 W
(1)
For more information on the PWP package, refer to TI technical brief, literature number SLMA002.
(2)
Test board conditions:
1. 3” x 3”, 4 layers, thickness: 0.062”
2. 1.5 oz. copper traces located on the top of the PCB
3. 1.5 oz. copper ground plane on the bottom of the PCB
4. 0.5 oz. copper ground planes on the 2 internal layers
5. 12 thermal vias (see “Recommended Land Pattern” in applications section of this data sheet)
(3)
Maximum power dissipation may be limited by over current protection.
ADDITIONAL 6A SWIFT DEVICES, (REFER TO SLVS398 AND SLVS400)
DEVICE OUTPUT VOLTAGE DEVICE OUTPUT VOLTAGE DEVICE OUTPUT VOLTAGE
TPS54611 0.9 V TPS54614 1.8 V TPS54610 Adjustable
TPS54612 1.2 V TPS54615 2.5 V TPS54673 Disabled sink during
startup
TPS54613 1.5 V TPS54616 3.3 V TPS54680 Sequencing