Datasheet

PH
PVIN
GND
BOOT
VSENSE
COMP
TPS54622
EN
RT/CLK
SS/TR
Exposed
Thermal
Pad
Css
Rrt
R3
C1
Cboot
Co
Lo
R1
R
2
Cin
C2
VIN
VIN
VOUT
PWRGD
50
55
60
65
70
75
80
85
90
95
100
1 2
3
4
5
60
Output Current - A
Efficiency - %
VIN = 8 V
VIN = 12 V
VIN = 17 V
TPS54622
www.ti.com
SLVSA70B MARCH 2011REVISED JANUARY 2014
4.5-V to 17-V Input, 6-A Synchronous Step Down SWIFT Converter With Hiccup
Protection
Check for Samples: TPS54622
1
FEATURES
Power Good Output Monitor for Undervoltage
and Overvoltage
Integrated 26m / 19m MOSFETs
Adjustable Input Undervoltage Lockout
Split Power Rail: 1.6V to 17V on PVIN
Supported by SwitcherPro™ Software Tool
200kHz to 1.6MHz Switching Frequency
For SWIFT™ Documentation and
Synchronizes to External Clock
SwitcherPro™, visit http://www.ti.com/swift
0.6V ±1% Voltage Reference Over Temperature
Hiccup Current Limit
APPLICATIONS
Monotonic Start-Up into Pre-biased Outputs
High Density Distributed Power Systems
–40°C to 150°C Operating Junction
High Performance Point of Load Regulation
Temperature Range
Broadband, Networking and Optical
Adjustable Slow Start/Power Sequencing
Communications Infrastructure
DESCRIPTION
The TPS54622 in thermally enhanced 3.5mm x 3.5mm QFN package is a full featured 17V, 6A synchronous step
down converter which is optimized for small designs through high efficiency and integrating the high-side and
low-side MOSFETs. Further space savings are achieved through current mode control, which reduces
component count, and by selecting a high switching frequency, reducing the inductor's footprint.
The output voltage startup ramp is controlled by the SS/TR pin which allows operation as either a stand alone
power supply or in tracking situations. Power sequencing is also possible by correctly configuring the enable and
the open drain power good pins.
Cycle by cycle current limiting on the high-side FET protects the device in overload situations and is enhanced
by a low-side sourcing current limit which prevents current runaway. There is also a low-side sinking current limit
which turns off the low-side MOSFET to prevent excessive reverse current. Hiccup protection will be triggered if
the overcurrent condition has persisted for longer than the preset time. Thermal hiccup protection disables the
device when the die temperature exceeds the thermal shutdown temperature and enables the part again after
the built-in thermal shutdown hiccup time.
WHITE SPACE
SIMPLIFIED SCHEMATIC
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2011–2014, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

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