Datasheet

TPS54620
SLVS949C – MAY 2009– REVISED MAY 2011 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
(1) (2)
T
J
PACKAGE PART NUMBER
(3)
TPS54620RHL
–40°C to 150°C 14 Pin QFN
TPS54620RGY
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) The RHL package and the RGY package are exactly the same. The TPS54620RHL is recommended for all new orders.
(3) The packages are available taped and reeled. Add an R suffix to the device type (i.e., TPS54620RHLR). See applications section of
data sheet for layout information
ABSOLUTE MAXIMUM RATINGS
(1)
over operating temperature range (unless otherwise noted)
VALUE UNIT
VIN –0.3 to 20 V
PVIN –0.3 to 20 V
EN –0.3 to 6 V
BOOT –0.3 to 27 V
Input Voltage VSENSE –0.3 to 3 V
COMP –0.3 to 3 V
PWRGD –0.3 to 6 V
SS/TR –0.3 to 3 V
RT/CLK –0.3 to 6 V
BOOT-PH 0 to 7 V
Output Voltage PH –1 to 20 V
PH 10ns Transient –3 to 20 V
Vdiff (GND to exposed thermal pad) –0.2 to 0.2 V
RT/CLK ±100 µA
Source Current
PH Current Limit A
PH Current Limit A
PVIN Current Limit A
Sink Current
COMP ±200 µA
PWRGD –0.1 to 5 mA
Electrostatic Discharge (HBM) QSS 009-105 (JESD22-A114A) 2 kV
Electrostatic Discharge (CDM) QSS 009-147 (JESD22-C101B.01) 500 V
Operating Junction Temperature –40 to 150 °C
Storage Temperature –65 to 150 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
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