Datasheet

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ABSOLUTE MAXIMUM RATINGS
Recommended Operating Conditions
DISSIPATION RATINGS
(1) (2)
TPS54610
SLVS398F – JUNE 2001 – REVISED APRIL 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
T
A
OUTPUT VOLTAGE PACKAGE
(1) (2)
PART NUMBER
40 ° C to 85 ° C Adjustable down to 0.9 V Plastic HTSSOP (PWP) TPS54610PWP
(1) The PWP package is also available taped and reeled. Add an R suffix to the device type (i.e., TPS54610PWPR). See the application
section of the data sheet for PowerPAD drawing and layout information.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com .
over operating free-air temperature range unless otherwise noted
(1)
TPS54610
VIN, SS/ENA, SYNC -0.3 V to 7 V
RT -0.3 V to 6 V
V
I
Input voltage range
VSENSE -0.3 V to 4 V
BOOT -0.3 V to 17 V
VBIAS, COMP, PWRGD -0.3 V to 7 V
V
O
Output voltage range PH -0.6 V to 10 V
PH (transient < 10 ns) -2 V
PH Internally Limited
I
O
Source current
COMP, VBIAS 6 mA
PH 12 A
I
S
Sink current COMP 6 mA
SS/ENA, PWRGD 10 mA
Voltage differential AGND to PGND ± 0.3 V
T
J
Operating virtual junction temperature range -40 ° C to 125 ° C
T
stg
Storage temperature -65 ° C to 150 ° C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
MIN NOM MAX UNIT
Input voltage, V
I
3 6 V
Operating junction temperature, T
J
–40 125 ° C
THERMAL IMPEDANCE T
A
= 25 ° C T
A
= 70 ° C T
A
= 85 ° C
PACKAGE
JUNCTION-TO-AMBIENT POWER RATING POWER RATING POWER RATING
28 Pin PWP with solder 18.2 ° C/W 5.49 W
(3)
3.02 W 2.20 W
28 Pin PWP without solder 40.5 ° C/W 2.48 W 1.36 W 0.99 W
(1) For more information on the PWP package, see TI technical brief, literature number SLMA002.
(2) Test board conditions:
a. 3 inch x 3 inch, 4 layers, thickness: 0.062 inch
b. 1.5 oz. copper traces located on the top of the PCB
c. 1.5 oz. copper ground plane on the bottom of the PCB
d. 0.5 oz. copper ground planes on the 2 internal layers
e. 12 thermal vias (see Recommended Land Pattern in applications section of this data sheet
(3) Maximum power dissipation may be limited by over current protection.
2
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