Datasheet
TPS54560
SLVSBN0A –MARCH 2013–REVISED MARCH 2014
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VIN –0.3 65
EN –0.3 8.4
BOOT 73
Input voltage V
FB –0.3 3
COMP –0.3 3
RT/CLK –0.3 3.6
BOOT-SW 8
Output voltage SW –0.6 65 V
SW, 10-ns Transient –2 65
Operating junction temperature –40 150 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 Handling Ratings
MIN MAX UNIT
T
STG
Storage temperature range –65 150 °C
Human Body Model (HBM) ESD Stress Voltage
(2)
2 kV
V
ESD
(1)
Charged Device Model (HBM) ESD Stress Voltage
(3)
500 V
(1) Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges
into the device.
(2) Level listed above is the passing level per ANSI/ESDA/JEDEC JS-001. JEDEC document JEP155 states that 500V HBM allows safe
manufacturing with a standard ESD control process. terminals listed as 1000V may actually have higher performance.
(3) Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250V CDM allows safe
manufacturing with a standard ESD control process. terminals listed as 250V may actually have higher performance.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
IN
Supply input voltage 4.5 60 V
V
O
Output voltage 0.8 58.8 V
I
O
Output current 0 5 A
T
J
Junction Temperature –40 150 °C
7.4 Thermal Information
TPS54560
THERMAL METRIC
(1)(2)
UNIT
DDA (8 TERMINALS)
θ
JA
Junction-to-ambient thermal resistance (standard board) 42.0
ψ
JT
Junction-to-top characterization parameter 5.9
ψ
JB
Junction-to-board characterization parameter 23.4
°C/W
θ
JCtop
Junction-to-case(top) thermal resistance 45.8
θ
JCbot
Junction-to-case(bottom) thermal resistance 3.6
θ
JB
Junction-to-board thermal resistance 23.4
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) Power rating at a specific ambient temperature TA should be determined with a junction temperature of 150°C. This is the point where
distortion starts to substantially increase. See power dissipation estimate in application section of this data sheet for more information.
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