Datasheet

TPS54528
www.ti.com SLVSAY4C –JULY 2011–REVISED MARCH 2014
11.3 Thermal Information
This 8-terminal DDA package incorporates an exposed thermal pad that is designed to be directly connected to
an external heatsink. The thermal pad must be soldered directly to the printed board (PCB). After soldering, the
PCB can be used as a heatsink. In addition, through the use of thermal vias, the thermal pad can be attached
directly to the appropriate copper plane shown in the electrical schematic for the device, or alternatively, can be
attached to a special heatsink structure designed into the PCB. This design optimizes the heat transfer from the
integrated circuit (IC).
For additional information on the exposed thermal pad and how to use the advantage of its heat dissipating
abilities, see the Technical Brief, PowerPAD™ Thermally Enhanced Package, Texas Instruments Literature No.
SLMA002 and Application Brief, PowerPAD ™ Made Easy, Texas Instruments Literature No. SLMA004.
The exposed thermal pad dimensions for this package are shown in the following illustration.
Figure 18. Thermal Pad Dimensions
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