Datasheet

VFB
VREG5
SS
GND
EN
VIN
VBST
SW
EXPOSED
THERMAL PAD
AREA
BOOST
CAPACITOR
VOUT
VIA to Ground Plane
OUTPUT
INDUCTOR
OUTPUT
FILTER
CAPACITOR
SLOW
START
CAP
ANALOG
GROUND
TRACE
VIN
INPUT
BYPASS
CAPACITOR
VIN
FEEDBACK
RESISTORS
TO ENABLE
CONTROL
POWER GROUND
BIAS
CAP
Connection to
POWER GROUND
on internal or
bottom layer
VIN
HIGH FREQENCY
BYPASS
CAPACITOR
TPS54527
www.ti.com SLVSAY5C –JULY 2011–REVISED MAY 2012
14. Providing sufficient via is preferable for VIN, SW and PGND connection.
15. PCB pattern for VIN, SW, and PGND should be as broad as possible.
16. VIN Capacitor should be placed as near as possible to the device.
Figure 16. PCB Layout
Copyright © 2011–2012, Texas Instruments Incorporated 15
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