Datasheet

EXPOSED THERMAL
PAD AREA
BOOST
CAPACITOR
VOUT
VIA to Ground Plane
OUTPUT
INDUCTOR
OUTPUT
FILTER
CAPACITOR
SLOW
START
CAP
ANALOG
GROUND
TRACE
VIN
INPUT
BYPASS
CAPACITOR
VIN
FEEDBACK
RESISTORS
Etch on Bottom Layer
or Under Component
To Enable
Control
POWER
GROUND
BIAS
CAP
VBST
VO
SW3
SW1
SW2
VIN3 VIN1 VIN2
VFB
VREG5
GND
SS
PG
EN
PGND2
PGND1
16
7
5
6
2
3
4
1
15
12
11
9
8
10
14
13
VIN HIGH
FREQUENCY
BYPASS
CAPACITOR
Connection to
POWER GROUND
on internal or
bottom layer
TPS54526
SLVSB84B –MAY 2012–REVISED JANUARY 2014 www.ti.com
Figure 19. PCB Layout for RSA Package
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REVISION HISTORY
Changes from Original (May 2012) to Revision A Page
• Changed the Over/Under Voltage Protection section. From: "as the high-side MOSFET driver turns off and the low-
side MOSFET turns on" To: "as both the high-side and low-side MOSFET drivers turn off" ............................................... 8
Changes from Revision A (July 2013) to Revision B Page
• Change the data sheet Title From: 4.5-V to 18-V Input, 5.5-A Synchronous Step-Down Converter with Eco-mode ™
To: 4.5-V to 18-V Input, 3-A Synchronous Step-Down Converter with Eco-mode™ ........................................................... 1
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