Datasheet
TPS54519
SLVSAT3A –SEPTEMBER 2011–REVISED DECEMBER 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
T
J
PACKAGE PART NUMBER
–40°C to 140°C 3 × 3 mm QFN TPS54519RTE
ABSOLUTE MAXIMUM RATINGS
VALUE UNIT
MIN MAX
Input voltage VIN –0.3 7 V
EN –0.3 7
BOOT PH + 8
VSENSE –0.3 3
COMP –0.3 3
PWRGD –0.3 7
SS/TR –0.3 3
RT –0.3 6
Output voltage BOOT-PH 8 V
PH –0.6 7
PH 10 ns Transient –2 7
Source current EN 100 μA
RT 100
Sink current COMP 100 μA
PWRGD 10 mA
SS/TR 100 μA
Electrostatic discharge (HBM) 2 kV
Electrostatic discharge (CDM) 500 V
Operating Junction temperature, T
j
–40 140 °C
Storage temperature, T
stg
–65 150 °C
THERMAL INFORMATION
TPS54519
THERMAL METRIC
(1)(2)
UNITS
RTE (16 PINS)
θ
JA
Junction-to-ambient thermal resistance (standard board) 49.1
θ
JA
Junction-to-ambient thermal resistance (custom board)
(3)
37.0
ψ
JT
Junction-to-top characterization parameter 0.7
ψ
JB
Junction-to-board characterization parameter 21.8 °C/W
θ
JC(top)
Junction-to-case(top) thermal resistance 50.7
θ
JC(bot)
Junction-to-case(bottom) thermal resistance 7.5
θ
JB
Junction-to-board thermal resistance 21.8
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) Power rating at a specific ambient temperature T
A
should be determined with a junction temperature of 140°C. This is the point where
distortion starts to substantially increase. See power dissipation estimate in the application section of this data sheet for more
information.
(3) Test boards conditions:
(a) 2 inches x 2 inches, 4 layers, thickness: 0.062 inch
(b) 2 oz. copper traces located on the top of the PCB
(c) 2 oz. copper ground planes on the 2 internal layers and bottom layer
(d) 4 thermal vias (10mil) located under the device package
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