Datasheet
Table Of Contents
- FEATURES
- APPLICATIONS
- CONTENTS
- DESCRIPTION
- DEVICE RATINGS
- ABSOLUTE MAXIMUM RATINGS
- RECOMMENDED OPERATING CONDITIONS
- ELECTROSTATIC DISCHARGE (ESD) PROTECTION
- PACKAGE DISSIPATION RATINGS
- ELECTRICAL CHARACTERISTICS
- TYPICAL CHARACTERISTICS
- DEVICE INFORMATION
- BLOCK DIAGRAM
- APPLICATION INFORMATION
- FUNCTIONAL DESCRIPTION
- Voltage Reference
- Oscillator
- Input Undervoltage Lockout (UVLO) and Startup
- Enable and Timed Turn On of the Outputs
- Output Voltage Sequencing
- Soft Start
- Output Voltage Regulation
- Feedback Loop and Inductor-Capacitor (L-C) Filter Selection
- Inductor-Capacitor (L-C) Selection
- Maximum Output Capacitance
- Minimum Output Capacitance
- Modifying The Feedback Loop
- Example: TPS54386 Buck Converter Operating at 12-V Input, 3.3-V Output and 400-mA(P-P) Ripple Current
- Bootstrap for the N-Channel MOSFET
- Light Load Operation
- SW Node Ringing
- Output Overload Protection
- Operating Near Maximum Duty Cycle
- Dual Supply Operation
- Cascading Supply Operation
- Multiphase Operation
- Bypass and FIltering
- Over-Temperature Protection and Junction Temperature Rise
- Power Derating
- PowerPAD Package
- PCB Layout Guidelines
- FUNCTIONAL DESCRIPTION
- DESIGN EXAMPLES
- ADDITIONAL REFERENCES
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
TPS54383PWP ACTIVE HTSSOP PWP 14 90 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 125 54383
TPS54383PWPG4 ACTIVE HTSSOP PWP 14 90 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 125 54383
TPS54383PWPR ACTIVE HTSSOP PWP 14 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 125 54383
TPS54383PWPRG4 ACTIVE HTSSOP PWP 14 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 125 54383
TPS54386PWP ACTIVE HTSSOP PWP 14 90 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 125 54386
TPS54386PWPG4 ACTIVE HTSSOP PWP 14 90 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 125 54386
TPS54386PWPR ACTIVE HTSSOP PWP 14 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 125 54386
TPS54386PWPRG4 ACTIVE HTSSOP PWP 14 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 125 54386
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.