Datasheet
Bill of Materials
4-3
Schematic and Bill of Materials
4.2 Bill of Materials
Table 4–1 contains the bill of materials for the TPS54380EVM–001.
Table 4–1.TPS54373EVM-237 Bill of Materials
Count RefDes Description Size MFR Part Number
C1 Capacitor, POSCAP, 220 µF, 10 V, 40 mΩ, 20% D4 Sanyo 10TPB220M
1 C13 Capacitor, ceramic, 0.1 µF, 25 V, X7R, 10% 603 Std Std
1 C14 Capacitor, ceramic, 3300 pF, 50–V, X7R, 10% 603 Std Std
2 C15, C16 Open 62100
3 C2, C11,
C12
Capacitor, ceramic, 22 µF, 6.3–V, X5R, 20% 1210 Taiyo Yuden JMK325BJ226MN
2 C3, C5 Capacitor, ceramic, 0.047 µF, 25–V, X7R, 10% 603 Std Std
1 C4 Capacitor, ceramic, 1.0 µF, 10–V, X5R, 20% 603 Std Std
1 C6 Capacitor, ceramic, 1500 pF, 50–V, X7R, 10% 603 Std Std
1 C7 Capacitor, ceramic, 82 pF, 50–V, NPO, 5% 603 Std Std
1 C8 Capacitor, ceramic, 820 pF, 50–V, X7R, 10 % 603 Std Std
2 C9, C10 Capacitor, ceramic, 10 µF, 10–V, X5R, 20% 1210 Taiyo Yuden LMK325BJ106MN
4 D1, D2, D3,
D4
Diode, ultrafast rectifier, 1 A, 200 V SMB On Semi MURS120T3
3 J1, J2, J4 Terminal block, 2 pin, 6 A, 3,5 mm 75525 OST ED1514
3 J3, J5, J6 Header, 2 pin, 100 mil spacing, (36–pin strip) 0.100 x 2 Sullins PTC36SAAN
3 –– Shunt, 100 mil, black 0.100 3M 929950–00
1 L1 Inductor, SMT, 1.0 µH, 8.5 A, 10 mΩ 0.270 sq Vishay IHLP–2525CZ–01
1 R1, R6 Resistor, chip, 10.0 kΩ, 1/16 W, 1% 603 Std Std
1 R2 Resistor, chip, 9.76 kΩ, 1/16 W, 1% 603 Std Std
1 R3 Resistor, chip, 6.34 kΩ, 1/16 W, 1% 603 Std Std
1 R4 Resistor, chip, 71.5 kΩ, 1/16 W, 1% 603 Std Std
1 R5 Resistor, chip, 590 Ω, 1/16 W, 1% 603 Std Std
1 R7 Resistor, chip, 0 Ω,, 1/16 W, 1% 603 Std Std
1 R8 Resistor, chip, 2.4 Ω,, 1/8 W, 1% 1206 Std Std
3 TP1, TP3,
TP6
Test point, black, 1 mm 0.038”, 6400” Farnell 240–333
7 TP2, TP4,
TP5, TP8,
TP9, TP10,
TP11
Test point, red, 1 mm 0.038”, 6400” Farnell 240–345
1 TP7 Adaptor, 3,5-mm probe clip (or 131–5031–00) 72900 Tektronix 131–4244–00
1 U1 IC, IFET power controller, adj V, 3A PWP20 TI TPS54373PWP
1 –– PCB, 3 In × 3 In × 0.062 In Any SLVP237
Notes: 1) These assemblies are ESD sensitive, ESD precautions are observed.
2) These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.
3) These assemblies must comply with workmanship standards IPC–A–610 Class 2.
4) Ref designators marked with an asterisk (’**’) cannot be substituted. All other components can be substituted with
equivalent MFG’s components.