Datasheet

 
 
 
SLVS519A − MAY 2004 − REVISED OCTOBER 2004
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17
0.1942
0.0150
0.06
0.0256
0.1700
0.1340
0.0690
0.0400
0.0400
0.0400
Minimum recommended exposed copper
area for powerpad. 5mil stencils may
require 10 percent larger area.
Connect Pin 10 AGND
and Pin 11 PGND to
Analog Ground plane in
this area for optimum
performance.
Minimum recommended top
side Analog Ground area.
0.0400
Minimum recommended thermal vias: 4 x
.013 dia. inside powerpad area and
4 x .013 dia. under device as shown.
Additional .018 dia. vias may be used if top
side Analog Ground area is extended.
0.0570
j
0.0130
8 PL
0.1970
0.0371
Figure 24. Thermal Considerations for PowerPAD Layout