Datasheet

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SLVS456C − OCTOBER 2003 − REVISED OCTOBER 2004
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2
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during
storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
T
A
OUTPUT VOLTAGE PACKAGE PART NUMBER
−40°C to 85°C Adjustable to 0.891 V Plastic HTSSOP (PWP) TPS54350PWP
(1)
The PWP package is also available taped and reeled. Add an R suffix to the device type (i.e. TPS54350PWPR).
PACKAGE DISSIPATION RATINGS
(1)
PACKAGE
THERMAL IMPEDANCE
JUNCTION-TO-AMBIENT
T
A
= 25°C
POWER RATING
T
A
= 70°C
POWER RATING
T
A
= 85°C
POWER RATING
16-Pin PWP with solder(2) 42.1°C/W 2.36 1.31 0.95
16-Pin PWP without solder 151.9°C/W 0.66 0.36 0.26
(1)
See Figure 46 for power dissipation curves.
(2)
Test Board Conditions
1. Thickness: 0.062”
2. 3” x 3”
3. 2 oz. Copper traces located on the top and bottom of the PCB for soldering
4. Copper areas located on the top and bottom of the PCB for soldering
5. Power and Ground planes, 1 oz. Copper (0.036 mm thick)
6. Thermal vias, 0.33 mm diameter, 1.5 mm pitch
7. Thermal isolation of power plane
For more information, refer to TI technical brief SLMA002.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
(1)
UNIT
VIN −0.3 V to 21.5 V
VSENSE −0.3 V to 8.0 V
Input voltage range, V
I
UVLO −0.3 V to 8.0 V
Input voltage range, V
I
SYNC −0.3 V to 4.0 V
ENA −0.3 V to 4.0 V
BOOT VI(PH) + 8.0 V
VBIAS −0.3 to 8.5 V
LSG −0.3 to 8.5 V
SYNC −0.3 to 4.0 V
Output voltage range, V
O
RT −0.3 to 4.0 V
Output voltage range, V
O
PWRGD −0.3 to 6.0 V
COMP −0.3 to 4.0 V
PH −1.5 V to 22 V
PH Internally Limited (A)
Source current, I
O
LSG (Steady State Current) 10 mA
Source current, I
O
COMP, VBIAS 3 mA
SYNC 5 mA
LSG (Steady State Current) 100 mA
Sink current, I
S
PH (Steady State Current) 500 mA
Sink current, I
S
COMP 3 mA
ENA, PWRGD 10 mA
Voltage differential AGND to PGND ±0.3 V
Operating virtual junction temperature range, T
J
−40°C to +150°C
Storage temperature, T
stg
−65°C to +150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C
(1)
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.