Datasheet
Bill of Materials
4-3
Schematic and Bill of Materials
4.2 Bill of Materials
The bill of materials for the TPS54350EVM−235 is given by
Table 4−1.TPS54350EVM-235 Bill of Materials
Count Ref Des Description Size MFR Part Number
− C1 Capacitor, aluminum, 100 µF, 35 V, 20%, FC
Series
0.335 x 0.374 Panasonic EEVFC1V101P
1 C11 Capacitor, ceramic, 3300 pF, 50 V, X7R, 10% 603 std std
− C12 Capacitor, aluminum, xxx µF, x V, 20%
(UE Series)
7343 std std
− C5 Capacitor, ceramic, xxx µF, vv V, [temp], [tol] 805 std std
1 C2 Capacitor, POSCAP, 100 µF, 6.3 V, 45 mΩ,
20%
7343 (D) Sanyo 6TPC100M
2 C3, C10 Capacitor, ceramic, 0.1 µF, 16 V, X7R, 10% 603 std std
1 C4 Capacitor, ceramic, 1.0 µF, 16 V, X7R, 10% 1206 std std
1 C6 Capacitor, ceramic, 82 nF, 16 V, X7R, 10% 603 std std
1 C7 Capacitor, ceramic, 1800 pF, 50 V, X7R, 10% 603 std std
1 C8 Capacitor, ceramic, 33 nF, 50 V, X7R, 10% 603 std std
1 C9 Capacitor, ceramic, 10 µF, 25 V, X5R, 20% 1210 Taiyo Yuden TMK325BJ106MN
− D1 Diode, schottky, 3 A, 40 V SMC Motorola MBRS340T3
2 J1, J2 Terminal block, 2 pin, 6 A, 3.5 mm 75525 OST ED1514
1 L1 Inductor, SMT, 10 µH, 8 A, 20 mΩ 0.51 x 0.51 Vishay IHLP−5050CZ
1 Q1 Transistor, MOSFET, Nch, 11.5 A, 30 V
9.5 mΩ
0.160 x 0.130 Fairchild FDR6674A
1 R1 Resistor, chip, 1.00 kΩ, 1/16 W, 1% 603 std std
1 R10 Resistor, chip, 4.7 Ω, 1/2 W, 5% 2010 std std
1 R2 Resistor, chip, 374 Ω, 1/16 W, 1% 603 std std
1 R3 Resistor, chip, 768 Ω, 1/16 W, 1% 603 std std
− R4, R6,
R7, R11
Resistor, chip, xx Ω, 1/16 W, 1% 603 std std
1 R5 Resistor, chip, 137 Ω, 1/16 W, 1% 603 std std
1 R8 Resistor, chip, 10.0 kΩ, 1/16 W, 1% 603 std std
1 R9 Resistor, chip, 0 Ω, 1/16 W, 1% 603 std std
4 TP1, TP3,
TP4, TP8
Test point, red, 1 mm 0.038 Farnell 240−345
4 TP2, TP5,
TP6, TP7
Test point, black, 1 mm 0.038 Farnell 240−333
1 TP9 Adaptor, 3,5 mm probe clip (or 131−5031−00) 0.2 Tektronix 131−4244−00
1 U1 IC, dc/dc converter PWP16 TI TPS54350PWP
1 −− PCB, 3 In x 3 In x 0.062 In Any SLVP235
Notes: 1) These assemblies are ESD sensitive, ESD precautions must be observed.
2) These assemblies must be clean and free from flux and all contaminants. Use of no-clean flux is not acceptable.
3) These assemblies must comply with workmanship standards IPC-A-610 Class 2.
4) Reference designators marked with an asterisk (**) cannot be substituted. All other components can be substituted
with equivalent MFG’s components.