Datasheet

1
2
3
4
5
6
7
8
BOOT
VIN
EN
SS
PH
GND
COMP
VSENSE
1
2
3
4
5
6
7
8
BOOT
VIN
EN
SS
PH
GND
COMP
VSENSE
PowerPAD
(Pin 9)
TM
TPS54331
SLVS839D –JULY 2008– REVISED JANUARY 2012 www.ti.com
ELECTRICAL CHARACTERISTICS (continued)
T
J
= –40°C to 150°C, VIN = 3.5V to 28V (unless otherwise noted)
DESCRIPTION TEST CONDITIONS MIN TYP MAX UNIT
THERMAL SHUTDOWN
Thermal Shutdown 165 °C
SLOW START (SS PIN)
Charge current V
(SS)
= 0.4 V 2 μA
SS to VSENSE matching V
(SS)
= 0.4 V 10 mV
DEVICE INFORMATION
PIN ASSIGNMENTS
PIN ASSIGNMENTS
D PACKAGE
DDA PACKAGE
(TOP VIEW)
(TOP VIEW)
PIN FUNCTIONS
PIN DESCRIPTION
NAME NO.
BOOT 1 A 0.1 μF bootstrap capacitor is required between BOOT and PH. If the voltage on this capacitor falls
below the minimum requirement, the high-side MOSFET is forced to switch off until the capacitor is
refreshed.
VIN 2 Input supply voltage, 3.5 V to 28 V.
EN 3 Enable pin. Pull below 1.25V to disable. Float to enable. Programming the input undervoltage lockout with
two resistors is recommended.
SS 4 Slow start pin. An external capacitor connected to this pin sets the output rise time.
VSENSE 5 Inverting node of the gm error amplifier.
COMP 6 Error amplifier output, and input to the PWM comparator. Connect frequency compensation components
to this pin.
GND 7 Ground.
PH 8 The source of the internal high-side power MOSFET.
PowerPAD™ 9 GND pin must be connected to the exposed pad for proper operation. This pin is only available in the
DDA package.
4 Copyright © 2008–2012, Texas Instruments Incorporated