Datasheet
TPS54325
SLVS932D –MAY 2009–REVISED AUGUST 2012
www.ti.com
ORDERING INFORMATION
(1)
TRANSPORT
T
A
PACKAGE
(2) (3)
ORDERABLE PART NUMBER
MEDIA, QUANTITY
TPS54325PWP Tube
PowerPAD™
–45°C to 85°C
(HTSSOP) – PWP
TPS54325PWPR Tape and Reel
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) All package options have Cu NIPDAU lead/ball finish.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE UNIT
V
IN
, V
CC
, EN –0.3 to 20 V
V
BST
–0.3 to 26 V
V
BST
(vs SW1, SW2) –0.3 to 6.5 V
V
I
Input voltage range
V
FB
, V
O
, SS, PG –0.3 to 6.5 V
SW1, SW2 –2 to 20 V
SW1, SW2 (10 ns transient) –3 to 20 V
V
REG5
–0.3 to 6.5 V
V
O
Output voltage range
P
GND1
, P
GND2
–0.3 to 0.3 V
V
diff
Voltage from GND to POWERPAD –0.2 to 0.2 V
Human Body Model (HBM) 2 kV
ESD rating Electrostatic discharge
Charged Device Model (CDM) 500 V
T
J
Operating junction temperature –40 to 150 °C
T
stg
Storage temperature –55 to 150 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
THERMAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
THERMAL METRIC
(1)
MIN TYP MAX UNIT
θ
JA
Junction-to-ambient thermal resistance 55.6 °C/W
θ
JCtop
Junction-to-case (top) thermal resistance 51.3 °C/W
θ
JB
Junction-to-board thermal resistance 26.4 °C/W
Ψ
JT
Junction-to-top characterization parameter 1.8 °C/W
Ψ
JB
Junction-to-board characterization parameter 20.6 °C/W
θ
JCbot
Junction-to-case (bottom) thermal resistance 4.3 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).
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