Datasheet

°
2.31
7
1
2.46
14
8
Thermal Pad
TPS54325
SLVS932D –MAY 2009–REVISED AUGUST 2012 www.ti.com
Input Capacitor Selection
The TPS54325 requires an input decoupling capacitor and a bulk capacitor is needed depending on the
application. A ceramic capacitor over 10-mF is recommended for the decoupling capacitor. An additional 0.1-µF
capacitor from pin 14 to ground is recommended to improve the stability of the over-current limit function. The
capacitor voltage rating needs to be greater than the maximum input voltage.
Bootstrap Capacitor Selection
A 0.1-μF ceramic capacitor must be connected between the VREG5 to GND pin for proper operation. It is
recommended to use a ceramic capacitor.
THERMAL INFORMATION
This PowerPAD™ package incorporates an exposed thermal pad that is designed to be connected to an external
heatsink. The thermal pad must be soldered directly to the printed board (PCB). After soldering, the PCB can be
used as a heatsink. In addition, through the use of thermal vias, the thermal pad can be attached directly to the
appropriate copper plane shown in the electrical schematic for the device, or alternatively, can be attached to a
special heatsink structure designed into the PCB. This design optimizes the heat transfer from the integrated
circuit (IC).
For additional information on the PowerPAD™ package and how to use the advantage of its heat dissipating
abilities, refer to Technical Breif, PowerPAD™ Thermally Enhanced Package, Texas Instruments Literature No.
SLMA002 and Application Brief, PowerPAD™ Made Easy, Texas Instruments Literature No. SLMA004.
The exposed thermal pad dimensions for this package are shown in the following illustration.
Figure 13. Thermal Pad Dimensions
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