Datasheet

TPS54310-Q1
SGLS280D − JANUARY 2005 − REVISED JUNE 2009
www.ti.com
3
RECOMMENDED OPERATING CONDITIONS
MIN NOM MAX UNIT
Input voltage range, V
I
3 6 V
Operating junction temperature, T
J
−40 125 °C
PACKAGE DISSIPATION RATINGS
(1) (2)
PACKAGE
THERMAL IMPEDANCE
JUNCTION-TO-AMBIENT
T
A
= 25°C
POWER RATING
T
A
= 70°C
POWER RATING
T
A
= 85°C
POWER RATING
20-pin PWP with solder 26°C/W 3.85 W
(3)
2.12 W 1.54 W
20-pin PWP without solder 57.5°C/W 1.73 W 0.96 W 0.69 W
(1)
For more information on the PWP package, see the Texas Instruments technical brief (SLMA002).
(2)
Test board conditions:
1. 3” × 3”, 2 layers, Thickness: 0.062”
2. 1.5 oz copper traces located on the top of the PCB
3. 1.5 oz copper ground plane on the bottom of the PCB
4. Ten thermal vias (see the recommended land pattern in application section of this data sheet)
(3)
Maximum power dissipation may be limited by overcurrent protection.