Datasheet

TPS54310-Q1
SGLS280D − JANUARY 2005 − REVISED JUNE 2009
www.ti.com
10
2-layer board. Documentation for the TPS54310
evaluation module can be found on the Texas Instruments
web site under the TPS54310 product folder and in the
application note (SLVA109).
LAYOUT CONSIDERATIONS FOR THERMAL
PERFORMANCE
For operation at full rated load current, the analog ground
plane must provide adequate heat dissipating area. A
3 inch by 3 inch plane of 1 ounce copper is recommended,
though not mandatory, depending on ambient temperature
and airflow. Most applications have larger areas of internal
ground plane available and the PowerPAD should be
connected to the largest area available. Additional areas
on the top or bottom layers also help dissipate heat, and
any area available should be used when 3 A or greater
operation is desired. Connection from the exposed area of
the PowerPAD to the analog ground plane layer should be
made using 0.013 inch diameter vias to avoid solder
wicking through the vias. Six vias should be in the
PowerPAD area with four additional vias located under the
device package. The size of the vias under the package,
but not in the exposed thermal pad area, can be increased
to 0.018. Additional vias beyond the 10 recommended that
enhance thermal performance should be included in areas
not under the device package.
Minimum Recommended Exposed
Copper Area For Powerpad. 5mm
Stencils may Require 10 Percent
Larger Area
0.2454
0.0150
0.06
0.0256
0.1700
0.1340
0.0620
0.0400
0.0400
0.0400
0.0600
0.0227
0.0600
0.1010
6 PL ∅ 0.0130
4 PL ∅ 0.0180
Connect Pin 1 to Analog Ground Plane
in This Area for Optimum Performance
Minimum Recommended Top
Side Analog Ground Area
Minimum Recommended Thermal Vias: 6 × 0.013 dia.
Inside Powerpad Area 4 × 0.018 dia. Under Device as
Shown. Additional 0.018 dia. Vias May be Used if Top Side
Analog Ground Area is Extended.
0.2560
Figure 11. Recommended Land Pattern for 20-Pin PWP PowerPAD