Datasheet
TPS54294
SLVSB00D –OCTOBER 2011–REVISED SEPTEMBER 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
(1)
T
A
PACKAGE ORDERING PART NUMBER PINS OUTPUT SUPPLY
TPS54294PWPR Tape-and-Reel
PWP 16
TPS54294PWP Tube
–40℃ to 85℃
TPS54294RSAR
RSA 16 Tape-and-Reel
TPS54294RSAT
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1) (2)
VALUE UNIT
VIN1, VIN2, EN1, EN2 –0.3 to 20
VBST1, VBST2 –0.3 to 26
VBST1, VBST2 (10ns transient) –0.3 to 28
Input voltage range VBST1–SW1 , VBST2–SW2 –0.3 to 6.5 V
VFB1, VFB2 –0.3 to 6.5
SW1, SW2 –2 to 20
SW1, SW2 (10ns transient) –3 to 22
VREG5, PG1, PG2 –0.3 to 6.5
Output voltage range V
PGND1, PGND2 –0.3 to 0.3
Human Body Model (HBM) 2 kV
Electrostatic discharge
Charged Device Model (CDM) 500 V
T
A
Operating ambient temperature range –40 to 85 °C
T
STG
Storage temperature range –55 to 150 °C
T
J
Junction temperature range –40 to 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" are not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to IC GND terminal.
THERMAL INFORMATION
TPS54294
THERMAL METRIC
(1)
UNITS
PWP (16) PINS RSA (16) PINS
θ
JA
Junction-to-ambient thermal resistance 47.5 34.9
θ
JCtop
Junction-to-case (top) thermal resistance 27.1 40.0
θ
JB
Junction-to-board thermal resistance 20.8 11.8
°C/W
ψ
JT
Junction-to-top characterization parameter 1.0 0.7
ψ
JB
Junction-to-board characterization parameter 20.6 11.8
θ
JCbot
Junction-to-case (bottom) thermal resistance 2.7 3.3
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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