Datasheet

TPS54226

www.ti.com

SLVSA14E –OCTOBER 2009–REVISED JULY 2011

Input Capacitor Selection

The TPS54226 requires an input decoupling capacitor and a bulk capacitor is needed depending on the

application. A ceramic capacitor over 10 μF is recommended for the decoupling capacitor. An additional 0.1 µF

capacitor from pin 14 to ground is recommended to improve the stability of the over-current limit function. The

capacitor voltage rating needs to be greater than the maximum input voltage.

Bootstrap Capacitor Selection

A 0.1 µF ceramic capacitor must be connected between the VBST to SW pin for proper operation. It is

recommended to use a ceramic capacitor.

VREG5 Capacitor Selection

A 1.0 µF ceramic capacitor must be connected between the VREG5 to GND pin for proper operation. It is

recommended to use a ceramic capacitor.

THERMAL INFORMATION

The PWP 14 pin package incorporates an exposed PowerPAD™ and the QFN 16 pin package incorporates a

similar exposed thermal pad. These exposed thermal pads are designed to be connected to an external heatsink.

The thermal pad must be soldered directly to the printed board (PCB). After soldering, the PCB can be used as a

heatsink. In addition, through the use of thermal vias, the thermal pad can be attached directly to the appropriate

copper plane shown in the electrical schematic for the device, or alternatively, can be attached to a special

heatsink structure designed into the PCB. This design optimizes the heat transfer from the integrated circuit (IC).

For additional information on the PowerPAD™ package and how to use the advantage of its heat dissipating

abilities, see Technical Brief, PowerPAD™ Thermally Enhanced Package, Texas Instruments Literature No.

SLMA002 and Application Brief, PowerPAD™ Made Easy, Texas Instruments Literature No. SLMA004.

The exposed thermal pad dimensions for the PWP 14 pin and QFN 16 pin packages are shown in the Thermal

Pad Mechanical Data section of this data sheet.

Product Folder Link(s): TPS54226