Datasheet
Table Of Contents
- FEATURES
- APPLICATIONS
- DESCRIPTION
- ABSOLUTE MAXIMUM RATINGS
- THERMAL INFORMATION
- RECOMMENDED OPERATING CONDITIONS
- ELECTRICAL CHARACTERISTICS
- DEVICE INFORMATION
- OVERVIEW
- DETAILED DESCRIPTION
- PWM Operation
- PWM Frequency and Adaptive On-Time Control
- Auto-Skip Eco-Mode Controlsection title From: Light Load Eco-Mode Control To: Auto-Skip Eco-Mode ControlChanged section title From: Light Load Mode Control To: Light Load Eco-Mode Control
- Soft Start and Pre-Biased Soft Start
- Power Good
- Output Discharge Control
- Current Protection
- Over/Under Voltage Protection
- UVLO Protection
- Thermal Shutdown
- TYPICAL CHARACTERISTICS
- Revision History
VOUT
VFB
VREG5
SS
GND
PG
EN
VCC
VIN
VBST
SW2
SW1
PGND1
PGND2
EXPOSED
POWERPAD
AREA
BOOST
CAPACITOR
VCC
INPUT
BYPASS
CAPACITOR
VOUT
VIA toGroundPlane
OUTPUT
INDUCTOR
OUTPUT
FILTER
CAPACITOR
SLOW
START
CAP
ANALOG
GROUND
TRACE
VIN
INPUT
BYPASS
CAPACITOR
VIN
FEEDBACK
RESISTORS
EtchonBottomLayer
orUnderComponent
ToEnable
Control
VCC
POWERGROUND
BIAS
CAP
Additional
Thermal
Vias
Additional
Thermal
Vias
Connectionto
POWERGROUND
oninternalor
bottomlayer
TPS54226
SLVSA14E –OCTOBER 2009– REVISED JULY 2011
www.ti.com
LAYOUT CONSIDERATIONS
The following layout guidelines are provided using the PWP 14 pin package as an example. The general
guidelines and routing are also applicable to the QFN 16 pin package. Allowance should be made for the
differences in the package pin configurations.
1. Keep the input switching current loop as small as possible.
2. Keep the SW node as physically small and short as possible to minimize parasitic capacitance and
inductance and to minimize radiated emissions. Kelvin connections should be brought from the output to the
feedback pin of the device.
3. Keep analog and non-switching components away from switching components.
4. Make a single point connection from the signal ground to power ground.
5. Do not allow switching current to flow under the device.
6. Keep the pattern lines for VIN and PGND broad.
7. Exposed pad of device must be connected to PGND with solder.
8. VREG5 capacitor should be placed near the device, and connected PGND.
9. Output capacitor should be connected to a broad pattern of the PGND.
10. Voltage feedback loop should be as short as possible, and preferably with ground shield.
11. Lower resistor of the voltage divider which is connected to the VFB pin should be tied to SGND.
12. Providing sufficient via is preferable for VIN, SW and PGND connection.
13. PCB pattern for VIN, SW, and PGND should be as broad as possible.
14. If VIN and VCC is shorted, VIN and VCC patterns need to be connected with broad pattern lines.
15. VIN Capacitor should be placed as near as possible to the device.
Figure 15. TPS54226 Layout
16 Copyright © 2009–2011, Texas Instruments Incorporated
Product Folder Link(s): TPS54226